Waterproof Pcb Mount Rotary Switch

Condition for Reflow

1. Heating method

Double heating method with infrared heater.

2. Temperature measurement

Thermocouple 0.1 to 0.2 Φ CA(K) or CC(T) at solder joints (copper foil surface). A heat resisting tape

should be used for fix measurement.

3. Temperature profile

(1) The above temperature shall be measured of the top of switch. There are cases where PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC board's and others. Care, should be taken to prevent the switch's surface temperature from exceeding 260°C.

(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.

Attention:
1.It is suggest to use more than 3% scaling powder of solder paste, avoid the soldering flux entering the switch so that the switch is invalid.
2.when designing the press handle, please refer to the drawing provided, do not press the switch directly with a sharp object, and the handle needs to be pressed vertically at the center of the switch, and press the handle to press the system at ±3°.
3.switch welding process, should pay special attention to the temperature and time control at 255±2℃,not more than 5 second. otherwise the temperature is too high,it will affect the switch life.
4.when welding, the switch should be kept OFF to avoid the switch from being damaged.